Difference between revisions of "SP - Cold Electronics"
JimStewart (talk | contribs) |
JimStewart (talk | contribs) |
||
| Line 110: | Line 110: | ||
=Management= | =Management= | ||
[http://lbne2-docdb.fnal.gov:8080/cgi-bin/ShowDocument?docid=10621 Basis of Estimate for Electronics Construction 10kt module] Last revised July 2015. | [http://lbne2-docdb.fnal.gov:8080/cgi-bin/ShowDocument?docid=10621 Basis of Estimate for Electronics Construction 10kt module] Last revised July 2015. | ||
| + | [http://lbne2-docdb.fnal.gov:8080/cgi-bin/RetrieveFile?docid=10621&filename=BOE%20130.05.08%20DUNE%20CE.xlsx&version=11 BOE worksheet in excel] | ||
=Navigation= | =Navigation= | ||
*[https://www.mediawiki.org/wiki/Help:Formatting formatting help] | *[https://www.mediawiki.org/wiki/Help:Formatting formatting help] | ||
*[https://dune.bnl.gov/wiki/Main_Page BNL DUNE wiki home] | *[https://dune.bnl.gov/wiki/Main_Page BNL DUNE wiki home] | ||
Revision as of 14:21, 3 November 2016
Contents
- 1 Cold Electronics
- 2 Test Stands
- 3 ProtoDUNE Electronics installation
- 4 Interface Control Documents
- 5 Grounding and Shielding
- 6 Management
- 7 Navigation
Cold Electronics
Cold Electronics Overview
Picture of the cold electronics and general description
Key Documents
- Cold Electronics review webpage
- Front End ASIC datasheet
- Cold ADC ASIC datasheet
- ColDATA specification
- Cold Cable datasheets
- Warm Interface documentation
Publications
LAr TPC Electronics CMOS Lifetime at 300 K and 77 K and Reliability Under Thermal Cycling, Shaorui Li (BNL, NSLS) , Jie Ma (SUNY, Stony Brook) , Gianluigi De Geronimo, Hucheng Chen, Veljko Radeka (BNL, NSLS), IEEE Trans.Nucl.Sci. 60 (2013) 4737-4743
Front End Readout Electronics of the MicroBooNE Experiment, H. Chen, G. De Geronimo, F. Lanni, D. Lissauer, D. Makowiecki, V. Radeka, S. Rescia, C. Thorn, B. Yu (Brookhaven), Phys.Procedia 37 (2012) 1287-1294
Readout electronics for the MicroBooNE LAr TPC, with CMOS front end at 89K, H. Chen, K. Chen, G. De Geronimo, F. Lanni, D. Lissauer, D. Makowiecki, V. Radeka, S. Rescia, C. Thorn, B. Yu (Brookhaven), JINST 7 (2012) C12004
Front-end ASIC for a Liquid Argon TPC, Gianluigi De Geronimo (Brookhaven) et al.., IEEE Trans.Nucl.Sci. 58 (2011) 1376-1385
APA electronics interface
Cold ASICS
Cold Frond End ASIC
Cold ADC
Front End Motherboards (FEMB)
Cold Cables
Technical description of the cold data cable insulation
Material Data Safety sheet for THV_500G
Warm Electronics
Warm Electronics Crate (WEC)
Power Timing Card (PTC)
Warm Interface Boards (WIB)
Racks Power and warm cables
The 12V power to the Warm Interface Carte is provided by Weiner MPOD power supplies. ProtoDUNE will use MODEL Mpod LX-R mainframes. Which are the Mpod crates with fan and controller; 8U;10slots; rear modules; with display local control;up to 3kW LV/600W HV. The LV power module to the WEC is the <POD LV module MPV8016I, The MPV8016I is an 8 channel, 0 to 15V with 5A per channel rating; 50W/ch power capacity ; 125V floating isolation; and <2mVp-p ripple.
Weiner MPOD LV module web page
As an alternate power distribution the Wiener PL500 series LV power modules are considered.
Slow Control
Test Stands
FE ASIC test
ADC test
FEMB test
Cable Tests
BNL Integration test
ProtoDUNE Electronics installation
Interface Control Documents
Grounding and Shielding
Grounding Overview talk by Terri
Summary documents on grounding
Management
Basis of Estimate for Electronics Construction 10kt module Last revised July 2015. BOE worksheet in excel
